6 in 1 BGA Schablonenvorlage BGA153/162/169/186/221/254 EMCP EMMC
9,07 €
Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. leaded (Pb) balls and lead free (No Pb) balls. 245℃-260℃(Maximun).
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