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Microelectronics Packaging Handbook: Semiconductor Packaging by R.R. Tummala (En

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By R.R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein. - >Chapter 9. - Glossary And Symbols. - Authors' Biographies. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems.

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ISBN-13:

9780412084416
Book Title:

Microelectronics Packaging Handbook
ISBN:

9780412084416

None:

International Standard : tracked-no signature (7 to 15 business days) 56,48 EUR - Lieferung zwischen 17. February 2025 und 03. March 2025 (bei heutigem Zahlungseingang)
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