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Thermische und strukturelle elektronische Verpackungsanalyse für Weltraum und extreme Umgebung

Name: Thermische und strukturelle elektronische Verpackungsanalyse für Weltraum und extreme Umgebung
SKU: 365275300915
Price: 86.06 EUR
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86,06 €

New Space. Thermal/Structural Challenges in Miniaturizing. The Multi-Layer Insulation (MLI) Blanket. Heat Pipes. Convective Cooling of Semiconductors using a Nanofluid. Power Systems: The Tesla Turbine.

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Format:

Paperback
Language:

English
ISBN-13:

9781032160856
Author:

Juan Cepeda-Rizo, Jeremiah Gayle, Joshua Ravich
Type:

NA
Book Title:

Thermal and Structural Electronic Packaging Analysis for Space an
Publication Name:

NA
ISBN:

9781032160856

Standardversand:

Standard Int'l Postage 12,68 EUR - Lieferung zwischen 24. January 2025 und 29. January 2025 (bei heutigem Zahlungseingang)
Versand nach:

Weltweit
Versand ausgeschlossen:

Russische Föderation , Belarus , Bosnien und Herzegowina , Island , Serbien , Afghanistan , Libyen , Nauru , Somalia , Jemen , ... und weitere

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